Covering preparation, design, testing, packaging, and technical services, etc.
Multi-size array substrate
Material Synthesis
Monolithic Integration
Imaging Chip
Wire Bonding
Integrated Packaging
Air Tightness / Push-pull Force / Mechanical Vibration / Reliability Test
Imaging Module
Imaging Test
Certification / Failure Analysis
Collaborate with top universities / research institutes both domestically and internationally
Serve university teachers / scientific researchers
Completed imaging test / time
Prepare and process imaging chips / pieces
An increasing number of domestic and overseas universities, research institutes, and other partners have made scientific breakthroughs and published high-impact journal papers by utilizing the Yingrui infrared monolithic integrated perception verification platform.
End-to-end micro/nano fabrication, packaging, bonding, and reliability services for monolithic and heterogeneous integrated devices, from wafer-level processing to chip-scale packaging.
Advanced imaging and optoelectronic characterization platforms for spatial, spectral, temporal, and quantum-efficiency performance evaluation.
We look forward to long-term friendly cooperation with you!
10th Floor, Building B3, Longshan Innovation Park Phase I, Wuhan, Hubei Province, China
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